|연구원||Postdoctoral Scholar for UCLA Center for Heterogeneous Integration and Performance Scaling|
|마감일||2019. 06. 30|
|기관명||[국외] UCLA 바로가기 ☞|
Postdoctoral Scholar for UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS)
Electrical and Computer Engineering
University of California, Los Angeles
Recruitment Period : Open December 5th, 2018 through June 30th, 2019
UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS) seeks a full-time postdoctoral scholar with experience in flexible electronics area to work on a fan-out wafer-level packaging based platform, namely FlexTrateTM (https://chips.ucla.edu/research/project/5). The successful candidate will be a hands-on engineer, and will be required to undertake BEOL fabrication and characterization in cleanroom environment. Candidates should have 3 or more years of experience in a cleanroom environment processing and good knowledge of photolithography, thin film deposition and etching, and electroplating. Candidates should preferably have experience in flip-chip bonding. This individual will also report on the findings, communicate within CHIPS consortium members.
Preferred background includes but not limited to Applied Physics, Material Science or Electrical Engineering.
￭ Knowledge of semiconductor technology and processing
￭ Three or more years of cleanroom processing experience
￭ The ability to function effectively in a team environment
￭ Excellent and effective written and verbal communication skills
￭ Experienced with new process design, development, and troubleshooting
￭ Able to carry out these tasks independently
￭ Professional demeanor at all times, devoting work hours to job
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